The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Jun. 15, 2022
Renesas Electronics Corporation, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
A wiring substrate includes: a first insulating layer; a ground plane formed on the first insulating layer; a second insulating layer formed on the first insulating layer such that the ground plane is covered with the second insulating layer; a first signal wiring formed on the second insulating layer; a third insulating layer formed on the second insulating layer such that the first signal wiring is covered with the third insulating layer; and a second signal wiring formed on the third insulating layer and electrically connected with the first signal wiring. The first signal wiring is arranged in a region overlapping with a portion of a heat radiating plate. The second signal wiring is not arranged in the region. The ground plane has an opening portion located at a position overlapping with the first signal wiring. The opening portion is formed so as to extend along the first signal wiring.