The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Oct. 12, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongkyu Kim, Anyang-si, KR;
Minjung Kim, Cheonan-si, KR;
Kyounglim Suk, Suwon-si, KR;
Seokhyun Lee, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution substrate having first and second surfaces opposing one another, a first semiconductor chip on the first surface of the redistribution substrate, a passive device and a metal post on the second surface of the redistribution substrate and electrically connected to the redistribution pattern, a second encapsulant encapsulating at least side surfaces of the passive device and the metal post, a second insulating layer on a lower surface of the metal post and a lower surface of the second encapsulant, and having an opening exposing at least a portion of the lower surface of the metal post, and a connection bump filling the opening of the second insulating layer and in direct contact with the lower surface of the exposed metal post, wherein the metal post has a height greater than a height of each of the redistribution pattern and the redistribution via.