The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Apr. 15, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Kuo-Lung Hou, Taichung, TW;

Ming-Hsien Lin, Taichung, TW;

Che-I Kuo, Hsinchu, TW;

Yung Hsin Lu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 3/38 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76873 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01);
Abstract

An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.


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