The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

May. 20, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Domenico Balzano, Torre Annunziata, IT;

Enrico Camillo Beretta, Sengkang, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/44 (2006.01); G11C 29/52 (2006.01);
U.S. Cl.
CPC ...
G11C 29/44 (2013.01); G11C 29/52 (2013.01);
Abstract

Implementations described herein relate component overprovisioning in layered devices. In some implementations, a test device may include one or more components configured to perform, on a set of memory components of a memory device, a set of production tests. The one or more components may be configured to identify, based on the set of production tests, a failure of a memory component of the memory device. The one or more components may be configured to reconfigure the memory device to downsize the memory device from a first configuration associated with the set of memory components to a second configuration associated with a first subset of the set of memory components.


Find Patent Forward Citations

Balzano, Domenico. (2025). Component overprovisioning in layered devices (U.S. Patent No. 12237033). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12237033

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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