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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12237013 B1

PDFFull Text
Date of Patent:
Feb. 25, 2025

Filed:

Jul. 12, 2021

Integrated assemblies and methods of forming integrated assemblies

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shyam Surthi, Boise, ID (US);

Matthew Thorum, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Wells St. John P.S.

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 23/532 (2006.01); G11C 16/04 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
G11C 16/0483 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02);
Abstract

Some embodiments include an integrated assembly having a vertical stack of alternating first and second levels. A panel extends through the stack. The first levels have proximal regions adjacent the panel, and have distal regions further from the panel than the proximal regions. The distal regions include conductive structures. The conductive structures have a first thickness. The proximal regions include insulative structures. The insulative structures have a second thickness at least about as large as the first thickness. Some embodiments include methods of forming integrated assemblies.

Find Patent Forward Citations

Surthi, Shyam. (2025). Integrated assemblies and methods of forming integrated assemblies (U.S. Patent No. 12237013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12237013

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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