The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Aug. 30, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yang Lu, Boise, ID (US);

Creston M. Dupree, San Jose, CA (US);

Smruti Subhash Jhaveri, Boise, ID (US);

Hyun Yoo Lee, Boise, ID (US);

John Christopher Sancon, Boise, ID (US);

Kang-Yong Kim, Boise, ID (US);

Francesco Douglas Verna-Ketel, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); G06F 13/16 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); G06F 13/1668 (2013.01);
Abstract

Described apparatuses and methods facilitate bus training with multiple dice, such as multiple memory dice. A controller can communicate with multiple dice to perform bus training by sending a test pattern and receiving in return a feedback pattern indicative of the bits detected by the dice. Because suitable signal timing can differ between dice, even those using the same bus, a controller may train each die separately from the others. In some situations, however, individualized training may be infeasible. To accommodate such situations, logic associated with two or more dice can combine, using at least one logical operation, bits as detected from the test pattern into a combined feedback pattern. A timing parameter that is jointly suitable for multiple dice can be determined, and the bus training may be concluded, responsive to the combined feedback pattern matching the test pattern. The multiple dice may be stacked or linked.


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