The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jul. 26, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Raanan Sover, Tirat Carmel, IL;

Eytan Mann, Modiin, IL;

Rafi Ben-Tal, Givat Ada, IL;

Richard S Perry, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/18 (2006.01); H01R 12/72 (2011.01); H05K 1/11 (2006.01); H05K 7/14 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G06F 1/185 (2013.01); G06F 1/186 (2013.01); H01R 12/72 (2013.01); H05K 1/117 (2013.01); H05K 7/1417 (2013.01); H01L 23/5386 (2013.01); H05K 1/181 (2013.01);
Abstract

An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.


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