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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12233606 B1

PDFFull Text
Date of Patent:
Feb. 25, 2025

Filed:

Nov. 28, 2023

Support material formulation and additive manufacturing processes employing same

Applicant:

Stratasys Ltd., Rehovot, IL;

Inventors:

Yuval Vidavsky, Moshav Sitriya, IL;

Dani Peri, Rehovot, IL;

Mariana Pokrass, Rehovot, IL;

Avraham Levy, Petach-Tikva, IL;

Eynat Matzner, Adi, IL;

Assignee:

Stratasys Ltd., Rehovot, IL;

Attorney:
Primary Examiner:

Shane Fang

Int. Cl.
CPC ...
B29C 64/40 (2017.01); B29C 35/08 (2006.01); B29C 64/112 (2017.01); B29C 64/35 (2017.01); B29K 33/04 (2006.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); C08F 2/48 (2006.01); C08F 220/28 (2006.01); C08F 283/06 (2006.01); C11D 3/04 (2006.01); C11D 3/08 (2006.01); C11D 7/06 (2006.01); C11D 7/14 (2006.01); G03F 7/00 (2006.01); G03F 7/027 (2006.01); G03G 9/087 (2006.01);
U.S. Cl.
CPC ...
B29C 64/40 (2017.08); B29C 64/112 (2017.08); B29C 64/35 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); C08F 2/48 (2013.01); C08F 220/28 (2013.01); C08F 220/286 (2020.02); C08F 283/06 (2013.01); C11D 3/044 (2013.01); C11D 3/08 (2013.01); C11D 7/06 (2013.01); C11D 7/14 (2013.01); G03G 9/08722 (2013.01); G03G 9/08728 (2013.01); G03G 9/08793 (2013.01); G03G 9/08795 (2013.01); B29C 35/08 (2013.01); B29K 2033/04 (2013.01); B33Y 80/00 (2014.12); G03F 7/0037 (2013.01); G03F 7/027 (2013.01);
Abstract

Novel support material formulations, characterized as providing a cured support material with improved dissolution rate, while maintaining sufficient mechanical strength, are disclosed. The formulations comprise a water-miscible non-curable polymer, a first water-miscible, curable material and a second, water-miscible material that is selected capable of interfering with intermolecular interactions between polymeric chains formed upon exposing the first water-miscible material to curing energy. Methods of fabricating a three-dimensional object, and a three-dimensional object fabricated thereby are also disclosed.

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