The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Feb. 25, 2022
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Hirotaka Taniguchi, Ogaki, JP;

Akihide Ishihara, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H05K 1/113 (2013.01); H05K 3/0044 (2013.01); H05K 3/4697 (2013.01); H05K 3/4661 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09472 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/308 (2013.01);
Abstract

A wiring substrate includes an insulating layer, and a build-up part formed on the insulating layer and including an interlayer insulating layer and a conductor layer. The build-up part has a cavity penetrating through the build-up part such that the cavity is formed to accommodate an electronic component and has an inner wall and a bottom surface having a groove and that the groove is extending entirely in an outer edge part of the bottom surface and formed continuously from the inner wall surface of the cavity.


Find Patent Forward Citations

Taniguchi, Hirotaka. (2025). Wiring substrate and method for manufacturing wiring substrate (U.S. Patent No. 12232268). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12232268

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…