The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Aug. 03, 2022
Applicant:

Unimicron Technology Corporation, Taoyuan, TW;

Inventors:

Po-Hsiang Wang, Taoyuan, TW;

Ming-Hao Wu, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/26 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/092 (2013.01); H05K 3/0017 (2013.01); H05K 3/26 (2013.01); H05K 3/321 (2013.01); H05K 3/4664 (2013.01); H05K 2201/09227 (2013.01);
Abstract

The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.


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