The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Dec. 22, 2021
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Jiraphat Charoenratpratoom, Bangkok, TH;
Phongsak Sawasdee, Bangkok, TH;
Wannasat Panphrom, Bangkok, TH;
Assignee:
UTAC Headquarters Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/49524 (2013.01); H01L 24/40 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 24/32 (2013.01); H01L 24/41 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40145 (2013.01); H01L 2224/40177 (2013.01); H01L 2224/40195 (2013.01); H01L 2224/4118 (2013.01); H01L 2224/48177 (2013.01);
Abstract
An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.