The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Jan. 17, 2023
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Chih-Hsien Chiu, Taichung, TW;

Ko-Wei Chang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 28/10 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01);
Abstract

An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.


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