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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12227661 B1

PDFFull Text
Date of Patent:
Feb. 18, 2025

Filed:

Oct. 23, 2023

Method for processing metal nanowire ink with metal ions

Applicant:

C3 Nano, Inc., Hayward, CA (US);

Inventors:

Ying-Syi Li, Fremont, CA (US);

Xiqiang Yang, Hayward, CA (US);

Yu Kambe, Berkeley, CA (US);

Xiaofeng Chen, San Jose, CA (US);

Hua Gu, Dublin, CA (US);

Steven Michael Lam, San Jose, CA (US);

Melanie Maniko Inouye, Fremont, CA (US);

Arthur Yung-Chi Cheng, Newark, CA (US);

Alex Da Zhang Tan, Singapore, SG;

Christopher S. Scully, Campbell, CA (US);

Ajay Virkar, San Mateo, CA (US);

Assignee:

EKC Technology, Inc., Hayward, CA (US);

Attorneys:

Christensen, Fonder, Dardi PLLC

Elizabeth A. Gallo

Peter S. Dardi

Primary Examiner:

Michael M Bernshteyn

Int. Cl.
CPC ...
C09D 11/52 (2014.01); B05D 1/00 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); B05D 1/26 (2006.01); B05D 1/28 (2006.01); B05D 3/02 (2006.01); B05D 5/06 (2006.01); C09D 11/08 (2006.01); C09D 11/10 (2014.01); C09D 11/102 (2014.01); C09D 11/106 (2014.01); C09D 11/14 (2006.01); C09D 101/02 (2006.01); C09D 139/06 (2006.01); C23C 30/00 (2006.01); G06F 3/044 (2006.01); H01B 1/02 (2006.01); H01B 1/22 (2006.01); H01B 13/30 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); G06F 3/045 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B05D 1/005 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/265 (2013.01); B05D 1/28 (2013.01); B05D 3/0254 (2013.01); B05D 5/06 (2013.01); C09D 11/08 (2013.01); C09D 11/10 (2013.01); C09D 11/102 (2013.01); C09D 11/106 (2013.01); C09D 11/14 (2013.01); C09D 101/02 (2013.01); C09D 139/06 (2013.01); C23C 30/00 (2013.01); G06F 3/0445 (2019.05); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01B 13/30 (2013.01); H05K 1/0274 (2013.01); H05K 1/097 (2013.01); G06F 3/044 (2013.01); G06F 3/045 (2013.01); G06F 2203/04103 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/026 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Methods for processing deposited metal nanowire inks with metal ions are used to form fused metal nanostructured networks. The metal nanowire inks include a hydrophilic polymer binder, such as a cellulose based binder. The metal nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

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