The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Jan. 26, 2021
Mitsubishi Materials Corporation, Tokyo, JP;
Kotaro Masuyama, Tokyo, JP;
Kohei Otogawa, Tokyo, JP;
Tomohiko Yamaguchi, Tokyo, JP;
Kiyotaka Nakaya, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
Provided is a bonding sheet using a copper particle that is less prone to deteriorate the sintering property due to oxidation of the copper particle, and can form a dense bonding layer having fewer voids, and can also bond an electronic component and the like with a high bonding strength. A bonding sheet () contains a copper particle () and a solvent () having a boiling point of 150° C. or higher, in which the copper particle () has a surface covered with an organic protective film, the content ratio of the copper particle () to the solvent () is in the range of 99:1 to 90:10 by mass, and the BET diameter of the copper particle () is in the range of 50 nm to 300 nm both inclusive.