The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Apr. 04, 2024
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Tatsuya Honda, Isehara, JP;

Masashi Tsubuku, Atsugi, JP;

Yusuke Nonaka, Atsugi, JP;

Takashi Shimazu, Machida, JP;

Shunpei Yamazaki, Setagaya, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1337 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G02F 1/1343 (2006.01); H01L 21/02 (2006.01); H01L 27/12 (2006.01); H01L 29/04 (2006.01); H01L 29/24 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H10K 59/121 (2023.01);
U.S. Cl.
CPC ...
H10D 30/6755 (2025.01); G02F 1/133345 (2013.01); G02F 1/1337 (2013.01); G02F 1/13394 (2013.01); G02F 1/134309 (2013.01); H10D 30/6757 (2025.01); H10D 62/405 (2025.01); H10D 62/80 (2025.01); H10D 64/68 (2025.01); H10D 86/423 (2025.01); H10D 86/60 (2025.01); H10D 99/00 (2025.01); G02F 2202/10 (2013.01); H01L 21/02565 (2013.01); H10K 59/1213 (2023.02);
Abstract

A semiconductor device includes a gate electrode, a gate insulating film which includes oxidized material containing silicon and covers the gate electrode, an oxide semiconductor film provided to be in contact with the gate insulating film and overlap with at least the gate electrode, and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region which is provided to be in contact with the gate insulating film and have a thickness less than or equal to 5 nm has a silicon concentration lower than or equal to 1.0 at. %, and a region in the oxide semiconductor film other than the first region has lower silicon concentration than the first region. At least the first region includes a crystal portion.


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