The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Aug. 05, 2022
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Christian Philipp Sandow, Haar, DE;

Wolfgang Roesner, Ottobrunn, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 21/266 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0834 (2013.01); H01L 29/0847 (2013.01); H01L 29/66348 (2013.01); H01L 29/7397 (2013.01); H01L 21/266 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01);
Abstract

A semiconductor device includes an IGBT in an IGBT portion of a semiconductor body and a diode in a diode portion of the semiconductor body. The diode includes an anode region of a first conductivity type and confined by diode trenches along a first lateral direction. Each of the diode trenches includes a diode trench electrode and a diode trench dielectric. A first contact groove extends into the anode region along a vertical direction from the first surface of the semiconductor body. An anode contact region of the first conductivity type adjoins a bottom side of the first contact groove. A cathode contact region of a second conductivity type adjoins a second surface of the semiconductor body opposite to the first surface. The IGBT includes a gate trench including a gate electrode and a gate dielectric, a source region, an emitter electrode, a drift region, and a second contact groove.


Find Patent Forward Citations

Loading…