The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Apr. 11, 2022
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Kirubakaran Periyannan, Santa Clara, CA (US);
Daniel Linnen, Naperville, IL (US);
Jayavel Pachamuthu, San Jose, CA (US);
Assignee:
Sandisk Technologies, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/0807 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/80345 (2013.01);
Abstract
Clamped semiconductor wafers and clamped semiconductor devices include reservoirs filled with a flowable metal which hardens to allow the wafers/devices to be shipped or stored. The hardened metal may also be reflowed to a liquid to allow clamping of the semiconductor wafers together and to allow clamping of the semiconductor packages together. The flowable metal may be filled into the reservoirs as a liquid or paste. Thereafter, the flowable metal may be cooled to harden the flowable metal into a clamping member.