The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Jan. 24, 2022
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventor:
Hailin Wang, Hefei, CN;
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 23/34 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01);
Abstract
There is provided a package substrate and a semiconductor structure with the same. The package substrate includes a body and a plurality of conducive bridges. The body includes an opening region. The plurality of conductive bridges are disposed separately in the opening region, and adjacent conductive bridges have a respective distance value. At least two of the distance values are not equal.
Wang, Hailin. (2025). Package substrate and semiconductor structure with same (U.S. Patent No. 12224244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12224244
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile