The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Aug. 09, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

S M Istiaque Hossain, Boise, ID (US);

Indra V. Chary, Boise, ID (US);

Anilkumar Chandolu, Boise, ID (US);

Sidhartha Gupta, Boise, ID (US);

Shuangqiang Luo, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H10B 41/20 (2023.01); H10B 41/35 (2023.01); H10B 43/20 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76832 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53266 (2013.01); H10B 41/20 (2023.02); H10B 41/35 (2023.02); H10B 43/20 (2023.02); H10B 43/35 (2023.02);
Abstract

A microelectronic device, including a stack structure including alternating conductive structures and dielectric structures is disclosed. Memory pillars extend through the stack structure. Contacts are laterally adjacent to the memory pillars and extending through the stack structure. The contacts including active contacts and support contacts. The active contacts including a liner and a conductive material. The support contacts including the liner and a dielectric material. The conductive material of the active contacts is in electrical communication with the memory pillars. Methods and electronic systems are also disclosed.


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