The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Feb. 05, 2021
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Gordon M. Grivna, Mesa, AZ (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
An apparatus for singulating a layer of material on a semiconductor substrate includes a chamber. The chamber is configured for supporting a semiconductor substrate attached to a carrier substrate, the semiconductor substrate can include a plurality of die formed as part of the semiconductor substrate and separated from each other by singulation lines and a layer of material disposed over a major surface of the semiconductor substrate. In some examples, the singulation lines terminate so that the layer of material extends over the singulation lines. The apparatus includes a pressure transfer vessel inside the chamber and a compression structure movably associated with the chamber. The compression structure can be configured so that the pressure transfer vessel is interposed between the semiconductor substrate and the compression structure. The compression structure and the pressure transfer vessel are adapted to apply pressure to the entire semiconductor substrate to singulate the layer of material that extends over the singulation lines.