The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Nov. 26, 2021
Applicant:
Changxin Memory Technologies, Inc., Hefei, CN;
Inventor:
Ping-Heng Wu, Hefei, CN;
Assignee:
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06544 (2013.01);
Abstract
A conductive structure includes: a conductive pillar and at least one embedded block arranged in the conductive pillar, a coefficient of thermal expansion of the embedded block being less than that of the conductive pillar. When the conductive pillar is heated and expanded, an extrusion effect of the conductive pillar on a structure adjacent to the conductive pillar can be reduced, thereby improving the performance of the semiconductor structure.