The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Feb. 01, 2019
Applicant:

Nissan Chemical Corporation, Tokyo, JP;

Inventors:

Takafumi Endo, Toyama, JP;

Yuichi Goto, Toyama, JP;

Yasunobu Someya, Toyama, JP;

Ryuta Mizuochi, Toyama, JP;

Satoshi Kamibayashi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C09D 179/04 (2006.01); H01L 21/027 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C09D 179/04 (2013.01); H01L 21/0274 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01);
Abstract

A resist underlayer film having, in particular, a high dry etching speed; the resist underlayer film formation composition; a resist pattern formation method, and a method for manufacturing a semiconductor device. The resist underlay film formation composition contains: a bifunctional or higher compound having one or more disulfide bonds; a trifunctional or higher compound and/or a reaction product; and a solvent. The bifunctional or higher compound is a dicarboxylic acid containing a disulfide bond. The trifunctional or higher compound is a compound containing three or more epoxy groups.


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