The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2025

Filed:

Jan. 12, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takuya Kawaguchi, Yamanashi, JP;

Takanobu Hotta, Yamanashi, JP;

Hideaki Yamasaki, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/06 (2006.01); C23C 16/34 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4404 (2013.01); C23C 16/06 (2013.01); C23C 16/34 (2013.01);
Abstract

There is provided a stress reducing method comprising: preparing a film forming apparatus configured to form a tungsten film on a substrate in a chamber by supplying a tungsten raw material gas and a reducing gas into the chamber; and making at least a part of a tungsten film deposited on an in-chamber component into a chlorine-containing tungsten film whose film stress is reduced by adjusting a chlorine concentration, when performing pre-coating in the chamber and/or when forming the tungsten film on the substrate, using the tungsten raw material gas and the reducing gas.


Find Patent Forward Citations

Kawaguchi, Takuya. (2025). Stress reducing method (U.S. Patent No. 12221693). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12221693

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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