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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12221595 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Oct. 31, 2019

Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer

Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Susumu Nakazaki, Tokyo, JP;

Kuniaki Miyahara, Tokyo, JP;

Tomoyuki Fukuyo, Tokyo, JP;

Assignee:

Resonac Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Gregory R Delcotto

Int. Cl.
CPC ...
C11D 3/24 (2006.01); B08B 3/08 (2006.01); C11D 3/28 (2006.01); C11D 3/30 (2006.01); C11D 3/32 (2006.01); C11D 3/34 (2006.01); C11D 7/28 (2006.01); C11D 7/32 (2006.01); C11D 7/34 (2006.01); C11D 7/50 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 7/5013 (2013.01); B08B 3/08 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/32 (2013.01); C11D 3/3445 (2013.01); C11D 3/3481 (2013.01); C11D 7/28 (2013.01); C11D 7/3209 (2013.01); C11D 7/3263 (2013.01); C11D 7/3281 (2013.01); C11D 7/34 (2013.01); C11D 7/50 (2013.01); H01L 21/02079 (2013.01); B08B 2220/01 (2013.01); B08B 2220/04 (2013.01); C11D 2111/22 (2024.01);
Abstract

Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.

Find Patent Forward Citations

Nakazaki, Susumu. (2025). Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer (U.S. Patent No. 12221595). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12221595

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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