The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Jun. 22, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jonathan W. Thibado, Beaverton, OR (US);

Aaron Gorius, Upton, MA (US);

Michael T. Crocker, Portland, OR (US);

Matthew J. Adiletta, Bolton, MA (US);

John C. Gulick, Portland, OR (US);

Emery E. Frey, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H05K 7/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 1/0393 (2013.01); H05K 3/284 (2013.01); H05K 3/366 (2013.01); H05K 7/02 (2013.01); H05K 7/20236 (2013.01);
Abstract

Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.


Find Patent Forward Citations

Loading…