The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Mar. 17, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Santosh Gangal, Bangalore, IN;
Tin Poay Chuah, Bayan Baru, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 24/16 (2013.01); H01L 28/24 (2013.01); H01L 28/60 (2013.01); H05K 1/113 (2013.01); H05K 1/162 (2013.01); H05K 1/167 (2013.01); H05K 3/423 (2013.01); H01L 28/22 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.