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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12218032 B1

PDFFull Text
Date of Patent:
Feb. 04, 2025

Filed:

Jan. 17, 2022

Semiconductor apparatus and manufacturing method thereof, and three-dimensional integrated circuit

Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventor:

Ping-Heng Wu, Hefei, CN;

Assignee:

CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;

Attorneys:

Syncoda LLC

Feng Ma

Primary Examiner:

Patricia D Valenzuela

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76898 (2013.01); H01L 23/3735 (2013.01); H01L 21/76831 (2013.01); H01L 21/76871 (2013.01);
Abstract

A semiconductor apparatus includes a substrate and a through silicon via (TSV) structure; a groove is disposed on the substrate; the TSV structure is disposed on the substrate; and a first end of the TSV structure is exposed in the groove, and a distance between an end surface of the first end and a bottom wall of the groove is smaller than the depth of the groove. The first end of the TSV structure is exposed so as to facilitate heat dissipation; the distance between the end surface of the first end and the bottom wall of the groove is smaller than the depth of the groove, i.e., the first end of the TSV structure is sunken in the groove, and other structures will not be affected.

Find Patent Forward Citations

Wu, Ping-Heng. (2025). Semiconductor apparatus and manufacturing method thereof, and three-dimensional integrated circuit (U.S. Patent No. 12218032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12218032

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