The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Apr. 27, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yutaka Yamasaki, Koshi, JP;
Takashi Terada, Koshi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); B23K 20/02 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); H01L 21/67092 (2013.01); H01L 23/544 (2013.01);
Abstract
A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.