The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Nov. 20, 2020
Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Tatsuhiko Kawakami, Tokyo, JP;

Noriyuki Sadaoka, Tokyo, JP;

Chiharu Tachikawame, Hitachinaka, JP;

Shuichi Tanaka, Hitachinaka, JP;

Assignee:

HITACHI ASTEMO, LTD., Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/30 (2006.01); G01B 11/16 (2006.01);
U.S. Cl.
CPC ...
G01B 5/30 (2013.01); G01B 11/16 (2013.01);
Abstract

Provided are a surface inspection device that evaluates a shape of a molded product with high accuracy in a shorter time than in the related art, a shape correction device, a surface inspection method, and a shape correction method. A point measurement sensorthat measures each of positions of predetermined pointsset on a surface of an inspection target; a surface measurement sensorthat measures a shape of a predetermined surfaceincluding the plurality of predetermined pointsby simultaneously measuring positions of a plurality of points of the inspection target; and a deformation amount computation unitthat obtains an amount of deformation of the inspection targetfrom a reference shape based on the positions of the predetermined pointsmeasured by the point measurement sensorand a normal direction of the predetermined surfacemeasured by the surface measurement sensorare included.


Find Patent Forward Citations

Loading…