The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Mar. 19, 2024
Winbond Electronics Corp., Taichung, TW;
Jin-Neng Wu, Tainan, TW;
WINBOND ELECTRONICS CORP., Taichung, TW;
Abstract
A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.