The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Aug. 31, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Dong Seup Lee, Mckinney, TX (US);

Hiroyuki Tomomatsu, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 27/06 (2006.01); H01L 29/66 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 28/20 (2013.01); H01L 29/66462 (2013.01); H01L 29/778 (2013.01);
Abstract

An integrated circuit (IC) includes a lower group III-N layer having a first composition over a substrate, and an upper group III-N layer having a different second composition over the lower group III-N layer. A gate electrode of a High Electron Mobility Transistor (HEMT) is located over the upper group III-N layer. First and second resistor contacts make a conductive connection to the lower group III-N layer. An unbiased group III-N cover layer is located on the upper group III-N layer in a resistor area including a high Rs 2-DEG resistor, where the unbiased group III-N cover layer is positioned between the first and second contacts.


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