The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Dec. 18, 2020
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4803 (2013.01); H01L 21/4842 (2013.01); H01L 21/4853 (2013.01); H01L 23/3107 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 25/18 (2013.01); H01L 23/24 (2013.01);
Abstract
Implementations of a semiconductor package may include a first substrate including a first group of leads physically coupled thereto and a second group of leads physically coupled thereto; a second substrate coupled over the first substrate and physically coupled to the first group of leads and the second group of leads; and one or more semiconductor die coupled between the first substrate and the second substrate. The second group of leads may be electrically isolated from the first substrate.