The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Sep. 13, 2021
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Valley Point #l2-03, SG;

Inventors:

Sang Yun Ma, Incheon, KR;

Dong Hee Kang, Gyenoggi-do, KR;

Sang Hyoun Lee, Incheon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 23/10 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/42 (2013.01); H01L 23/49833 (2013.01);
Abstract

In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.


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