The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Dec. 14, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Haruka Momota, Sagamihara, JP;

Koji Yasumori, Machida, JP;

Keizo Kawakita, Higashihiroshima, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/525 (2006.01); H01L 23/528 (2006.01); H01L 29/10 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 21/76802 (2013.01); H01L 23/5256 (2013.01); H01L 23/528 (2013.01); H10B 12/50 (2023.02);
Abstract

An apparatus includes an active region; a scribe region surrounding the active region; a test component in the scribe region; a pad electrode in the active region; and a power supply wiring of an upper wiring layer in the active region, the power supply wiring extending between the test component and the pad electrode; and an interconnection structure coupling the test component and the pad electrode across a border between the active region and the scribe region, the interconnection structure including a wiring portion of a lower wiring layer crossing the power supply wiring.


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