The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Sep. 10, 2021
Applicants:

Ngk Electronics Devices, Inc., Mine, JP;

Ngk Insulators, Ltd., Nagoya, JP;

Inventor:

Shigeru Yoshimura, Shimonoseki, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/42 (2006.01); C23C 18/50 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1651 (2013.01); C23C 18/1637 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C23C 18/50 (2013.01); H01L 21/4871 (2013.01); H01L 23/14 (2013.01); H01L 23/3736 (2013.01);
Abstract

A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer. The metal substrate includes a surface constituted of a plurality of crystal grains. The first intermediate plating layer is directly formed on the plurality of crystal grains of the metal substrate, contains a nickel element, and is non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate. The second intermediate plating layer is directly formed on the first intermediate plating layer. The precious metal plating layer is formed on the second intermediate plating layer.


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