The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Aug. 25, 2021
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Shailesh N. Joshi, Ann Arbor, MI (US);

Yanghe Liu, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/22 (2006.01); B22F 1/17 (2022.01); B22F 3/10 (2006.01); B22F 7/06 (2006.01); C08K 3/08 (2006.01); C23C 18/16 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); C22C 1/04 (2023.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
B22F 1/17 (2022.01); B22F 3/1035 (2013.01); B22F 7/064 (2013.01); B23K 35/22 (2013.01); C08K 3/08 (2013.01); C23C 18/1633 (2013.01); C23C 18/1635 (2013.01); H01L 23/3736 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 2301/30 (2013.01); B22F 2999/00 (2013.01); C08K 2003/085 (2013.01); C22C 1/0416 (2013.01); C22C 1/0425 (2013.01); C22C 1/0433 (2013.01); C22C 1/0466 (2013.01); C22C 1/0483 (2013.01); H01L 23/36 (2013.01); H01L 24/00 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29447 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10323 (2013.01); H01L 2924/10325 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.


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