The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Nov. 08, 2019
Applicant:
Fujimi Incorporated, Kiyosu, JP;
Inventors:
Junya Yamada, Kiyosu, JP;
Hiroyuki Ibe, Kiyosu, JP;
Nobuaki Kato, Kiyosu, JP;
Yuta Kato, Kiyosu, JP;
Yoshikazu Sugiyama, Kiyosu, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/05 (2022.01); B22F 1/052 (2022.01); B33Y 70/10 (2020.01); C22C 1/051 (2023.01); C22C 29/00 (2006.01); C22C 29/08 (2006.01); B22F 1/10 (2022.01); B22F 1/148 (2022.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 1/05 (2022.01); B22F 1/052 (2022.01); B33Y 70/10 (2020.01); C22C 1/051 (2013.01); C22C 29/005 (2013.01); C22C 29/08 (2013.01); B22F 1/10 (2022.01); B22F 1/148 (2022.01); B22F 10/28 (2021.01); B22F 2301/15 (2013.01); B22F 2302/10 (2013.01); B22F 2304/10 (2013.01); B33Y 10/00 (2014.12); Y10T 428/12014 (2015.01);
Abstract
There is provided a powder material that is for densifying a molded article manufactured by an additive layer manufacturing method and improving harness of the molded article. There is provided a powder material for use in additive layer manufacturing containing ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 40% or more.