The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

May. 21, 2022
Applicants:

Georgia Tech Research Corporation, Atlanta, GA (US);

Intel Corporation, Santa Clara, CA (US);

Inventors:

Omkar Gupte, Atlanta, GA (US);

Vanessa Smet, Atlanta, GA (US);

Gregorio R. Murtagian, Phoenix, AZ (US);

Assignees:

Georgia Tech Research Corporation, Atlanta, GA (US);

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 3/22 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.


Find Patent Forward Citations

Gupte, Omkar. (2025). Electronic device carrier structures including polymer layers as barriers to solid state solder diffusion and methods of forming the same (U.S. Patent No. 12207398). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12207398

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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