The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Dec. 14, 2021
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Toshiyuki Takasaki, Osaka, JP;
Ryota Furukawa, Osaka, JP;
Atsushi Harikai, Kyoto, JP;
Shogo Okita, Hyogo, JP;
Abstract
Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substratethat is held on a holding sheetthat is supported by a frame, the substrate including element regions and dicing regions; a protective film forming step of forming a protective filmso as to cover the frame, the holding sheet, and the substrate; a patterning step of removing a part of the protective filmso as to expose the dicing regions of the substrate; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrateinto a plurality of element chips; and a fluorine removing step of removing, together with the protective film, fluorine attached to the protective filmin the plasma dicing step.