The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Dec. 01, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kouichi Mizunaga, Koshi, JP;

Toshichika Takei, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70875 (2013.01); H01L 21/6838 (2013.01); H01L 21/68742 (2013.01); H01L 21/6875 (2013.01);
Abstract

A heat treatment unit Uincludes a heat plateconfigured to place a wafer W thereon and heat the wafer W placed thereon; multiple gap membersformed along a front surfaceof the heat plateon which the wafer W is placed, and configured to support the wafer W to secure a clearance V between the heat plateand the wafer W; a suction unitconfigured to suck the wafer W toward the heat plate; and an elevating pinconfigured to penetrate the heat plateand configured to be moved up and down to move the wafer W placed on the heat plateup and down. The front surfaceof the heat platehas a concave regioninclined downwards from an outer side toward an inner side thereof.


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