The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Dec. 26, 2019
Applicant:
Nitta Dupont Incorporated, Osaka, JP;
Inventor:
Kazuki Moriyama, Kyoto, JP;
Assignee:
NITTA DUPONT INCORPORATED, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01);
Abstract
A polishing slurry according to the present invention is a polishing slurry for polishing copper or a copper alloy, the polishing slurry including abrasives, an organic acid, an oxidizing agent, and alkali. The polishing slurry further includes polycarboxylic acid, and alkylbenzenesulfonic acid, in which a concentration of the polycarboxylic acid is 0.1 to 0.5 mass % in terms of concentration of sodium polycarboxylate, and a concentration of the alkylbenzenesulfonic acid is 0.3 mass % or more in terms of concentration of alkylbenzenesulfonate triethanolamine.