The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Dec. 31, 2018
Applicant:

Stratasys Ltd., Rehovot, IL;

Inventors:

Elena Shpayzer, Rehovot, IL;

Eduardo Napadensky, Natania, IL;

Raffy Sarfati, Kibbutz Mishmar David, IL;

Mayan Rumbak, Mazkeret Batia, IL;

Keren Goldshtein, Rehovot, IL;

Assignee:

Stratasys Ltd., Rehovot, IL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); B29C 64/112 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01); C08F 220/20 (2006.01); B29K 71/00 (2006.01); B29K 105/00 (2006.01); B33Y 70/10 (2020.01); C08F 220/18 (2006.01); C08F 222/10 (2006.01); C08F 222/22 (2006.01);
U.S. Cl.
CPC ...
C08F 220/20 (2013.01); B29C 64/112 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B29K 2071/02 (2013.01); B29K 2105/0094 (2013.01); B29K 2995/0046 (2013.01); B29K 2995/0092 (2013.01); B29K 2995/0093 (2013.01); B33Y 70/10 (2020.01); C08F 220/1811 (2020.02); C08F 222/102 (2020.02); C08F 222/1063 (2020.02); C08F 222/225 (2020.02);
Abstract

Modeling material formulation systems usable in additive manufacturing, 3D inkjet printing in particular, of three-dimensional objects, are provided. The formulations comprise two or more curable materials, such that an average molecular weight of the curable materials in each formulation is no more than 500 grams/mol, such that each formulation features a viscosity of no more than 50 centipoises at a temperature of 35° C. Kits comprising the formulations or formulation systems and additive manufacturing processes utilizing same are also provided.


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