The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Nov. 02, 2022
Unimicron Technology Corp., Taoyuan, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.