The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Feb. 18, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Katsuyuki Sakuma, Fishkill, NY (US);
Mukta Ghate Farooq, Hopewell Jct, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/488 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/4825 (2013.01); H01L 23/488 (2013.01); H01L 23/53228 (2013.01); H01L 24/14 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/8184 (2013.01);
Abstract
An approach to provide a method of joining a semiconductor chip to a semiconductor substrate, the approach includes depositing a nanoparticle paste and aligning each of one or more solder contacts on a semiconductor chip to a substrate bond pad. The approach includes sintering, in a reducing gaseous environment, the nanoparticle paste to connect the semiconductor chip to a semiconductor substrate bond pad.