The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Apr. 14, 2022
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shuuichi Kariyazaki, Tokyo, JP;

Ryuichi Oikawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01P 3/08 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16157 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19031 (2013.01);
Abstract

The wiring board has a first region overlapping a first semiconductor device and a second region not overlapping each of the first semiconductor device and a second semiconductor device. A first signal wiring of the wiring board has a first portion in the first region and a second portion in the second region. In a thickness direction of the wiring board, the second portion is between two ground patterns to which a reference potential is supplied, while the first portion has a portion not positioned between two ground patterns to which a reference potential is supplied. The first portion has a first wide portion having a larger width than a width of the second portion.


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