The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Sep. 16, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
You-Lung Yen, Taoyuan, TW;
Bernd Karl Appelt, Holly Springs, NC (US);
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 23/293 (2013.01);
Abstract
An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.