The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Mar. 14, 2023
Applicant:

Mpi Corporation, Hsinchu County, TW;

Inventors:

Sebastian Giessmann, Hsinchu County, TW;

Yu-Hsun Hsu, Hsinchu County, TW;

Assignee:

MPI CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/308 (2006.01); B23Q 3/16 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/308 (2013.01); B23Q 3/16 (2013.01); G01R 31/2831 (2013.01); B23Q 2240/002 (2013.01);
Abstract

A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.


Find Patent Forward Citations

Loading…