The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jan. 23, 2024
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Teruo Yoshino, Toyama, JP;

Takeshi Yasui, Toyama, JP;

Masaki Murobayashi, Toyama, JP;

Koichiro Harada, Toyama, JP;

Tadashi Terasaki, Toyama, JP;

Masanori Nakayama, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/505 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01); H05H 1/46 (2006.01);
U.S. Cl.
CPC ...
C23C 16/505 (2013.01); C23C 16/44 (2013.01); C23C 16/4583 (2013.01); C23C 16/52 (2013.01); H01J 37/321 (2013.01); H01J 37/32174 (2013.01); H01J 37/3244 (2013.01); H01J 37/32568 (2013.01); H01L 21/02238 (2013.01); H01L 21/02252 (2013.01); H01L 21/02274 (2013.01); H05H 1/46 (2013.01);
Abstract

A substrate processing apparatus comprising: a substrate process chamber having a plasma generation space where a processing gas is plasma-excited and a substrate processing space communicating with the plasma generation space; a substrate mounting table installed inside the substrate processing space and for mounting a substrate; an inductive coupling structure provided with a coil installed to be wound around an outer periphery of the plasma generation space; a substrate support table elevating part for raising and lowering the substrate mounting table; a gas supply part for supplying the processing gas to the plasma generation space; and a controller for controlling the substrate support table elevating part, based on a power value of a high-frequency power supplied to the coil, so that the substrate mounted on the substrate mounting table is positioned at a target height according to the power value and spaced apart from a lower end of the coil.


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