The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Dec. 01, 2021
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Steven C. Shackleton, Austin, TX (US);
Niyaz Khusnatdinov, Round Rock, TX (US);
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); C03C 15/02 (2006.01); C03C 17/06 (2006.01); C03C 17/23 (2006.01); G03F 7/00 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
C03C 17/06 (2013.01); C03C 15/02 (2013.01); C03C 17/23 (2013.01); G03F 7/0002 (2013.01); G03F 7/094 (2013.01); C03C 2217/73 (2013.01); C03C 2217/74 (2013.01); C03C 2218/355 (2013.01);
Abstract
A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.