The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Nov. 12, 2021
Applicant:

Harbin Institute of Technology, Harbin, CN;

Inventors:

Jian Cheng, Harbin, CN;

Mingjun Chen, Harbin, CN;

Wenqiang Wu, Harbin, CN;

Qi Liu, Harbin, CN;

Hao Yang, Harbin, CN;

Linjie Zhao, Harbin, CN;

Chao Tan, Harbin, CN;

Xumeng Cheng, Harbin, CN;

Henan Liu, Harbin, CN;

Tingzhang Wang, Harbin, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 5/00 (2006.01); B23C 3/00 (2006.01); G06F 17/11 (2006.01); G06F 17/16 (2006.01); G06F 30/17 (2020.01);
U.S. Cl.
CPC ...
B28D 5/007 (2013.01); B23C 3/00 (2013.01); B28D 5/0064 (2013.01); G06F 17/11 (2013.01); G06F 17/16 (2013.01); G06F 30/17 (2020.01); B23C 2226/42 (2013.01); B23C 2260/56 (2013.01); B23C 2265/08 (2013.01);
Abstract

A variable-step-distance micro-milling repair cutter path generating method for damage points on a surface of an optical crystal related to a field of optical material and optical element surface repair and includes steps of establishing a mathematical model of a repair profile; determining discrete contact points between a cutter and the repair profile to obtain a cutter contact control point set by a GPR path generating method to control a movement trend of a pseudo-random path; interpolating the cutter position control point set into a spatial curve by a NURBS modeling method; creating a UG curve in a UG software according to the mathematical model, and using the UG curve as the repair path to perform a machining process simulation. The method has good elimination effects on cutter marks with constant period and improves the ability of the KDP crystal to resist strong laser damage.


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